发明名称 Thin film transistor, method for manufacturing the same, and semiconductor device
摘要 In a thin film transistor, an increase in off current or negative shift of the threshold voltage is prevented. In the thin film transistor, a buffer layer is provided between an oxide semiconductor layer and each of a source electrode layer and a drain electrode layer. The buffer layer includes a metal oxide layer which is an insulator or a semiconductor over a middle portion of the oxide semiconductor layer. The metal oxide layer functions as a protective layer for suppressing incorporation of impurities into the oxide semiconductor layer. Therefore, in the thin film transistor, an increase in off current or negative shift of the threshold voltage can be prevented.
申请公布号 US9209283(B2) 申请公布日期 2015.12.08
申请号 US201514626150 申请日期 2015.02.19
申请人 Semiconductor Energy Laboratory Co., Ltd. 发明人 Kondo Toshikazu;Kishida Hideyuki
分类号 H01L29/00;H01L29/66;H01L27/12;H01L29/45;H01L29/786;H01L29/24;H01L29/49;H01L21/477;H01L21/02 主分类号 H01L29/00
代理机构 Robinson Intellectual Property Law Office, P.C. 代理人 Robinson Eric J.;Robinson Intellectual Property Law Office, P.C.
主权项 1. A method of manufacturing a semiconductor device comprising the steps of: forming an oxide semiconductor film over an insulating layer by a vacuum evaporation method, a pulsed laser deposition method, an ion plating method, or a metal organic chemical vapor deposition method; forming a first conductive layer after forming the oxide semiconductor film; forming a second conductive layer after forming the first conductive layer by a vacuum evaporation method, a pulsed laser deposition method, an ion plating method, or a metal organic chemical vapor deposition method; forming a source electrode layer and a drain electrode layer by processing the second conductive layer; forming a metal oxide layer between the source electrode layer and the drain electrode layer; and performing a heat treatment after forming the metal oxide layer, whereby a first region having a lower oxygen concentration than the oxide semiconductor film is formed between the source electrode layer and the oxide semiconductor film and a second region having a lower oxygen concentration than the oxide semiconductor film is formed between the drain electrode layer and the oxide semiconductor film.
地址 Atsugi-shi, Kanagawa-ken JP