发明名称 Method for the treatment and direct bonding of a material layer
摘要 A method for treating at least one first material layer including siloxane bonds, wherein at least one surface can be interlocked with a surface of a second material layer by direct bonding, the method including: at least one forced diffusion at a temperature greater than or equal to 30° C., at least in the first material layer, of chemical species including at least one pair of free electrons and at least one labile proton; and converting at least one portion of the siloxane bonds into silanol bonds in at least one portion of the first material layer extending from the surface to a depth greater than or equal to approximately 10 nm.
申请公布号 US9209068(B2) 申请公布日期 2015.12.08
申请号 US201214353883 申请日期 2012.10.24
申请人 Commissariat a l'energie atomique et aux energies alternatives 发明人 Moriceau Hubert;Fournel Franck;Morales Christophe;Rauer Caroline
分类号 H01L21/30;H01L21/46;H01L21/762;H01L21/20;H01L21/3105;H01L21/02;H01L21/223;H01L21/228;H01L21/306 主分类号 H01L21/30
代理机构 Oblon, McClelland, Maier & Neustadt, L.L.P. 代理人 Oblon, McClelland, Maier & Neustadt, L.L.P.
主权项 1. A method for treating at least one first material layer including siloxane bonds, wherein at least one surface of the first material layer is configured to be interlocked with a surface of a second material layer by direct bonding, the method comprising: at least one forced diffusion at a temperature greater than or equal to 30° C., at least in the first material layer, of chemical species comprising at least one pair of free electrons and at least one labile proton; and converting at least one portion of the siloxane bonds into silanol bonds in at least one portion of the first material layer extending from the surface to a depth greater than or equal to approximately 10 nm.
地址 Paris FR