Modifier for resin and resin composition using the same and formed article

摘要

A modifier for resin has an average particle size of 20 μm or more, wherein particles having an average particle size of 10 μm or less account for less than 30% by mass of the modifier, and particles having an average particle size of 10 μm or less account for 30% by mass or more of the modifier after irradiating the modifier with ultrasonic wave of 40 W for 5 minutes. Also a resin composition comprises 1 to 40% by mass of the modifier for resin and 99 to 60% by mass (the total amount of both components is 100% by mass) of a thermoplastic resin or a curable resin, and a molded article is produced by molding the same.

主权项

1. A resin composition, comprising:
(a) 1 to 40% by mass, based on the total mass of the resin composition, of a modifier comprising powder particles,wherein
(1) the powder particles are composed of agglomerates of particles of a graft copolymer, wherein the graft copolymer has a core-shell structure composed of a rubbery polymer as a trunk polymer and having grafted thereon a graft polymerizable vinyl-based monomer and the particles of the graft copolymer have an average particle size of 600 nm or more, (2) the powder particles have an average particle size of 20 μm or more, (3) the amount of powder particles having a particle size of 10 μm or less account for less than 30% by mass of the modifier, based on 100% by mass of the modifier, (4) when the modifier is irradiated with an ultrasonic wave of 40 W for 5 minutes, the amount of powder particles having a particle size of 10 μm or less is more than 30% by mass of the modifier, based on 100% by mass of the modifier, and (b) 99 to 60% by mass, based on the total mass of the resin composition, of a curable epoxy resin.