| 摘要 |
PROBLEM TO BE SOLVED: To reduce the protrusion press fit pressure by forming a plurality of through holes above a substrate in a heat sink, press-fitting a rod-like protrusion into each through hole, and then bonding the protrusion and the substrate, while improving the thermal conductivity by bonding each protrusion and substrate, and to enhance the airtightness on the front and back of the heat sink by arranging a thermally conductive sheet on the back surface (heating element contact surface), while enhancing the heat conduction efficiency from the heating element.SOLUTION: In a heat sink, a rod-like protrusion is press-fitted in each through hole on the surface of a substrate having a plurality of through holes, one end of which is flush with the back surface of the substrate, while the other end is projecting from the surface of the substrate and standing, and a thermally conductive sheet is bonded to the back surface of the substrate. |
