| 摘要 |
PROBLEM TO BE SOLVED: To provide a support substrate the end of which is bonded sufficiently, and to provide a printed wiring board using the same, and a method of manufacturing the same.SOLUTION: An insulating resin layer 5 is bonded to an adhesive resin layer 3 arranged on a support 2, via a copper foil 4 with a carrier having a size smaller than that of the support 2 and adhesive resin layer 3, in a support substrate 1 for circuit formation. Alternatively, an insulating resin layer 5 is bonded to an adhesive resin layer 3 arranged on a support 2, via more than one metal foil 8 having a size smaller than that of the support 2 and adhesive resin layer 3, in a support substrate 1 for circuit formation. A printed wiring board using the same, and a method of manufacturing the same are also provided. |
