发明名称 PLASMA PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a plasma processing apparatus that freely controls a plasma density distribution in a large control range while effectively eliminating undesired non-uniformity under which the center in the radial direction is a singular point of a plasma density distribution.SOLUTION: A capacitance coupling type plasma processing apparatus has a main magnet unit 32 and an auxiliary magnet unit 34 above an upper electrode 26. The main magnet unit 32 has a main yoke 34 and plural main electromagnet coils 36, 38, 40, 42. An auxiliary magnet unit 70 has plural rod-type electromagnets 72 which are arranged radially inside the main electromagnetic coil 36 on the innermost periphery of the main magnet unit 32 and displaced from the center axis line Z by only a predetermined distance so as to be spaced from one another at a fixed interval along the circumferential direction. A first set of rod-type electromagnets 72A make DC exciting current of a fixed current value flow in a forward direction through the auxiliary electromagnetic coils thereof, and a second set of rod-type electromagnets 72B make DC exciting current of the same current value flow in a reverse direction through the auxiliary electromagnetic coils thereof.
申请公布号 JP2015220352(A) 申请公布日期 2015.12.07
申请号 JP20140103118 申请日期 2014.05.19
申请人 TOKYO ELECTRON LTD 发明人 YOKOTA AKIHIRO;HIMORI SHINJI;OSHITA TATSURO;KUSANO SHU
分类号 H01L21/3065;C23C16/509;C23C16/52;H05H1/46 主分类号 H01L21/3065
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