| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting structure and a manufacturing method for the same that can mount electronic components on a substrate with high density, enhance the productivity of the mounting structure and reduce the manufacturing cost.SOLUTION: A mounting structure has a substrate 5 having plural wire layers 6a to 6d, and plural electronic components 8a to 8c which are mounted on plural wire layers 6a to 6d and have different external dimensions. The substrate 5 has a recess portion 11 in which the plural electronic components are disposed, and the recess portion 11 has plural step portions which are formed so that an opening 10 is stepwise reduced from one surface of the substrate 5 to the other surface of the substrate 5. The different wire layers are exposed to the respective step portions. The plural electronic components 8a to 8c are arranged in the recess portion 11 to confront one another in the increasing order of the external dimension from the other surface to the one surface, and joined to the plural wire layers 6a to 6d through conductive joint members 12, 13. At least one of the plural electronic components 8a to 8c is joined to each of the wire layers 6a to 6d of the plural step portions through the plural joint members 12, 13, respectively. |
