| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and an apparatus for manufacturing an optical module capable of carrying out mounting in which the warping of a chip is prevented.SOLUTION: There is provided a method for manufacturing an optical module for mounting, on an insulated circuit board, a chip 40 in which an active area for realizing a prescribed function is provided in the peripheral area of the prescribed edge 42a of a chip surface 42. The method includes the steps of: adsorbing a range 44c obtained excluding the active area from the chip surface; bringing an edge facing the prescribed edge and located on the reverse side of the chip into contact with the surface of the insulated circuit board; and bringing the whole of the reverse side of the chip into contact with the surface of the insulated circuit board. |
