SHEET-LIKE RESIN COMPOSITION AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a sheet-like resin composition which makes it possible to perform the alignment for mounting a semiconductor device in a simple manner without changing an existing process; and a method for manufacturing a semiconductor device by use of such a sheet-like resin composition.SOLUTION: A sheet-like resin composition for filling a space between an adherend and a semiconductor device electrically connected with the adherend has a parallel transmittance of 10% or more. The sheet-like resin composition preferably has a haze of 80% or less. It is preferable that the sheet-like resin composition exhibits a transmittance of 15% or more for a wavelength 580 nm.