| 摘要 |
PROBLEM TO BE SOLVED: To provide: a resin composition having excellent thermal conductivity and high adhesive strength; and a heat-conductive adhesive and a laminate containing the resin composition.SOLUTION: There is provided a resin composition which comprises silicon nitride, spherical thermally conductive particles and a resin, wherein the silicon nitride has a 50% particle diameter of 0.1 to 15 μm, the spherical thermally conductive particles have a 50% particle diameter of 10 to 100 μm, in the total of the silicon nitride, the spherical thermally conductive particles and the resin, the content of the silicon nitride is 2 to 30 vol.%, the content of the spherical thermally conductive particles is 30 to 80 vol.%, and the total of the silicon nitride and the spherical thermally conductive particles is 55 to 85 vol.%. |
