| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a piezoelectric device capable of setting the atmosphere to air pressure higher than atmospheric pressure, and improving a yield of hermetic sealing in a package welding step.SOLUTION: A method for manufacturing a piezoelectric device includes the steps of: preparing a base substrate 31, a lid 35, an energy beam source, and an energy beam transmission part; arranging the lid 35 in a junction part of the base substrate 31 by superposing it on the junction part; and welding the base substrate 31 and the lid 35. In the step of welding the base substrate 31 and the lid 35, the lid 35 is arranged in the atmosphere in which air pressure is higher than atmospheric pressure. |
