发明名称 RESIST COMPOSITION AND PRODUCTION METHOD OF CONDUCTIVE PATTERN USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a resist composition that is to be used for forming a cast for manufacturing a plated molded article and exhibits excellent printing property when printed on a substrate, excellent adhesiveness to the substrate, plating resistance, and peeling property with a peeling solution, and a production method of a conductive pattern using the resist composition.SOLUTION: The resist composition relating to the present invention is to be used for forming a cast for manufacturing a plated molded article, and the composition comprises a novolac resin (A), SiOparticles (B) and/or an adhesion agent (C) comprising a heterocyclic compound having a five-membered aromatic ring that contains at least two nitrogen atoms, and a solvent (D). The production method of a conductive pattern includes: a resist pattern formation step of forming a resist pattern on a surface of a substrate by a printing process using the above resist composition; and a conductive layer formation step of forming a conductive layer on the surface of the substrate by plating by using the resist pattern as a cast.
申请公布号 JP2015218364(A) 申请公布日期 2015.12.07
申请号 JP20140103108 申请日期 2014.05.19
申请人 TOKYO OHKA KOGYO CO LTD 发明人 ABE MASARU;TAKAHASHI MOTOKI;YOSHII YASUHIRO
分类号 C25D5/02;H05K3/18 主分类号 C25D5/02
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