| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which does not require refinement of a wiring width on a PCB substrate and achieves easy mounting and achieves downsizing of a chip; and provide a PCB substrate on which the semiconductor package is mounted; and provide a semiconductor device in which a semiconductor package is mounted on the PCB substrate.SOLUTION: A semiconductor package 100 comprises a re-wiring layer MRD arranged on an interlayer film 12 on an LSI 10, a post electrode MP arranged on the re-wiring layer, a protection layer 14 arranged on the interlayer film and a plurality of balls BMP connected with the re-wiring layer arranged on the post electrode, in which balls B, Bexisting on wiring paths of internal wiring W, W, Wconnected with inside lands of a plurality of lands LND which are arranged on the PCB substrate and can be connected with the plurality of balls are not connected (BMP (NC) with the re-wiring layer or are deleted. And provided are a PCB substrate 200 on which the semiconductor package is mounted and a semiconductor device 300 in which a semiconductor package is mounted on the PCB substrate. |
