| 摘要 |
The present invention conducts laser soldering by arranging a solder ball between terminals for electric connection, and radiating a laser beam. A device to conduct laser soldering to electrically connect a plurality of first terminals of a camera part to a plurality of second terminals of a printed circuit board respectively comprises: a rotating plate; a rotation driving part; a pick-up unit; an application unit; a solder ball arranging unit; and a laser unit. The rotating plate is installed to be able to rotate and has a plurality of mounting parts, on which a camera module having a camera part and the printed circuit board assembled thereto is mounted, arranged at intervals in a rotating direction. The rotation driving part drives the rotating plate in a rotating direction. The pick-up unit picks up the camera module from an accommodation part, which accommodates the camera module, and moves the camera module to the mounting parts. The application unit is arranged adjacently to the pick-up unit in a rotating direction, and applies an adhesive material to a first terminal or a second terminal of the camera module mounted on the mounting parts. The solder ball arranging unit is arranged adjacently to the application unit in a rotating direction, and arranges a solder ball on top of the adhesive material. The laser unit is arranged adjacently to the solder ball arranging unit in a rotating direction, and radiates a laser beam to the solder ball to electrically connect the first terminals to the second terminals. |
