发明名称 CURABLE RESIN COMPOSITION AND RESIN CURED PRODUCT
摘要 PROBLEM TO BE SOLVED: To provide a curable resin composition capable of exhibiting excellent impact resistance and heat resistance after curing, and a resin cured product produced by curing the curable resin composition.SOLUTION: The curable resin composition contains: (a) 50-90 pts.wt. of at least one epoxy resin selected from the group consisting of a bisphenol type epoxy resin, a dicyclopentadiene type epoxy resin, an anthracene type epoxy resin, and a biphenyl type epoxy resin; (b) 10-50 pts.wt. of a polyether di(meth)acrylate compound; (c) an epoxy resin curing agent; and (d) a radical polymerization initiator.
申请公布号 JP2015218259(A) 申请公布日期 2015.12.07
申请号 JP20140102759 申请日期 2014.05.16
申请人 SEKISUI CHEM CO LTD 发明人 YAGI MOTOHIRO
分类号 C08G59/18 主分类号 C08G59/18
代理机构 代理人
主权项
地址