| 摘要 |
The present invention relates to a semiconductor device having hybrid rewiring, and a manufacturing method thereof. More specifically, the present invention relates to a semiconductor device which complexly configures rewiring by a plating process and rewiring of a printing method, thereby providing reduction of the number of manufacturing process and the costs, and a manufacturing method thereof. In other words, according to the present invention, a narrow line pitch rewiring from multi-rewiring is formed by the plating process, and a wide line pitch rewiring is formed by using a low cost printing process, thereby realizing reduction of the number of manufacturing process and the manufacturing costs. |
