| 摘要 |
PROBLEM TO BE SOLVED: To achieve low cost while ensuring bonding reliability in wire bonding of a semiconductor device.SOLUTION: A BGA (Ball Grid Array) manufacturing method comprises the steps of: preparing a semiconductor chip 12 having an electrode pad 12b; subsequently removing a natural oxide film formed on a surface of the electrode pad 12b; further forming a first film 12d composed of a conductive member on the surface of the electrode pad 12b exposed by removal of the natural oxide film; subsequently connecting a wire 11 to the first film 12d; and forming an alloy layer 12e at a boundary surface between the wire 11 and the electrode pad 12b by bringing part of the wire 11 into contact with the electrode pad 12b. In this case, a crystal structure of the first film 12d is composed of a body-centered cubic lattice or a hexagonal close-packed lattice. |
