| 摘要 |
PROBLEM TO BE SOLVED: To provide a power control unit that can enhance mountability by miniaturizing the whole body with excellent cooling performance.SOLUTION: A reactor 21 of a step-up converter 18 is disposed in a cooling space 15a at the right end portion of a lamination type cooler 15, a semiconductor module constituting an inverter circuit 19 is disposed in a cooling space 15a at the left side of the reactor 21, and a component constituting a DC-DC converter 14 is disposed in a cooling space 15a at the left side of the semiconductor module. The lamination type cooler 15 (assembly 39) is provided at the front side in a case 12, and an output capacitor 24 and input capacitor 20 of the step-up converter 18 are disposed at the right and left sides of the rear side of the assembly 39. A circuit board is disposed on the upper surfaces of the output and input capacitors 24 and 20. |
