| 摘要 |
PROBLEM TO BE SOLVED: To inspect a side surface of an electronic component package such as a QFN package at high speed.SOLUTION: Two surface reflection prisms 50a, 50b are arranged in the periphery (four sides) obliquely downward to an outside of the side surface of a QFN package 10, and a CCD camera 52 is arranged downward thereof via a telecentric lens 51. When the QFN package 10 comes to an imaging position P, light from the side surface is reflected twice inside the two surface reflection prisms 50a, 50b, and the QFN package is downwardly imaged by the CCD camera 52. The two surface reflection prisms 50a, 50b are arranged at a position lower than the lower surface of the QFN package to be transferred, and thus, the QFN package can be imaged in the midst of a transfer path, and has no need to be moved in a direction vertical to the transfer path. |
