发明名称 HEAT PUMP HEATING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a technology capable of solving a situation where a dryness degree of a refrigerant sucked into a compressor is high, and temperature of the refrigerant discharged from the compressor becomes greatly higher than condensation temperature, in a heat pump heating device.SOLUTION: A heat pump heating device disclosed in the present specification includes: a condenser for exchanging heat between a refrigerant and a heated fluid and for condensing the refrigerant; a decompressor for decompressing the refrigerant from the condenser; an evaporator for evaporating the refrigerant from the decompressor; a compressor for pressurizing the refrigerant from the evaporator and for sending it out to the condenser; first temperature detection means arranged in a refrigerant flow passage between the compressor and the condenser and for detecting the temperature of the refrigerant; and second temperature detection means arranged in the refrigerant flow passage inside the condenser and for detecting the temperature of the refrigerant. The heat pump heating device performs refrigerant dryness degree drop control for dropping a dryness degree of the refrigerant sucked into the compressor, in the case where a difference between detection temperature of the first temperature detection means and detection temperature of the second temperature detection means exceeds a predetermined upper limit value.
申请公布号 JP2015218959(A) 申请公布日期 2015.12.07
申请号 JP20140103193 申请日期 2014.05.19
申请人 RINNAI CORP 发明人 IMAI SEISHI
分类号 F25B49/02;F25B1/00 主分类号 F25B49/02
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