| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for laminating conductive films capable of reducing a frame area still more, and the like.SOLUTION: A method for laminating conductive films includes: providing a first layer 72 used for scanning lines on a light-translucent substrate, providing a first insulating layer on the first layer 72; providing a second layer 73 used for signal lines on the first insulating layer, providing a second insulating layer on the second layer 73, providing a third layer 74 used for auxiliary wiring on the second insulating layer, and providing a fourth layer 75 used for auxiliary wiring and common electrodes on a third metal wiring layer. The thicker the width of the auxiliary wiring extended in a frame area 110a other than a display area is, the longer the wiring length from a circuit for outputting a signal to the auxiliary wiring is, and when all of the auxiliary wiring are bundled, the width is uniform and the electrical resistance of all of the auxiliary wiring to the circuit are equal. |
