| 摘要 |
PROBLEM TO BE SOLVED: To provide a small and thin flip-chip mounting type light-emitting device including a wavelength conversion layer for converting the wavelength of light emitted from a light-emitting element, and a method of manufacturing the same.SOLUTION: The method of manufacturing the light-emitting device includes the steps of: providing a sealing member 7 at least on and around an upper surface of a light-emitting element 5; removing at least that portion of the sealing member 7 which is located on an upper part of the light-emitting element 5, to form a recess surrounding the light-emitting element 5; and forming, in the recess, a wavelength conversion layer 10 for converting the wavelength of light emitted from the light-emitting element 5. |
