发明名称 GRINDING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a grinding device which can detect a center position of a tabular workpiece by employing simple constitution.SOLUTION: The grinding device includes: conveyance means 64 for carrying away a wafer from a cassette and placing the wafer on a chuck table; imaging means 68 for imaging the wafer 11 carried away from the cassette by the conveyance means; and control means for controlling the chuck table, grinding means, and the conveyance means. The imaging means includes: a camera for imaging the wafer; and light sources 84 and 86 for illuminating the wafer when imaging the wafer by the camera. In imaging the wafer by the imaging means, the wafer held by a holding part 74 of the conveyance means is positioned at an imaging position of the imaging means and the imaging means images the wafer while the image is held by the holding part. The control means has a center position detector for detecting a center of the wafer from a wafer image output from the camera, and controls the conveyance means so that the center of the wafer detected by the center position detector is placed in alignment with a rotation center of the chuck table.
申请公布号 JP2015217449(A) 申请公布日期 2015.12.07
申请号 JP20140100793 申请日期 2014.05.14
申请人 DISCO ABRASIVE SYST LTD 发明人 TSUNO TAKAHIKO
分类号 B24B49/12;B24B7/04;B24B41/06;H01L21/304 主分类号 B24B49/12
代理机构 代理人
主权项
地址