发明名称 WIRE ELECTRICAL DISCHARGE MACHINING DEVICE AND SEMICONDUCTOR WAFER MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To suppress disconnection of a wire even when a wire running speed is changed.SOLUTION: A wire electric discharge machining device 16 includes: two rotatable bobbins 1, 4; a bobbin drive controlling device 11 which controls rotations of the bobbins 1, 4; one line of a wire electrode 2 which forms a cutting wire part 2a and performs reciprocating running between the bobbins 1, 4; electric power suppliers 7A, 7B which supply power to the wire electrode 2; an electric discharge waveform oscillation control device 62 which controls an electric discharge machining voltage generated between the wire electrode 2 and an object 8 to be machined; a stage 13 for feeding the cutting which relatively changes the object 8 to be machined with respect to the wire electrode 2; a cutting stage drive controlling device 14 which controls the stage 13 for feeding the cutting; and a machining control device 12 which supervises the bobbin drive controlling device 11, the electric discharge waveform oscillation control device 62 and the cutting stage drive controlling device 14 and controls the electric machining voltage and an interval between the wire electrode 2 and the object 8 to be machined based on running speed information of the wire electrode 2 inputted from the bobbin drive controlling device 11.
申请公布号 JP2015217438(A) 申请公布日期 2015.12.07
申请号 JP20140099953 申请日期 2014.05.13
申请人 MITSUBISHI ELECTRIC CORP 发明人 MIYAKE HIDETAKA;ITOKAZU ATSUSHI;HASHIMOTO TAKASHI
分类号 B23H7/02;B23H7/10;B23H9/00 主分类号 B23H7/02
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