| 摘要 |
PROBLEM TO BE SOLVED: To provide a power module that secures a compact and light design and heat radiation performance, and is excellent in long-term reliability to thermal stress.SOLUTION: A joint block 12 at the upper portion of a heat radiation member 1 formed of aluminum is fitted in an opening portion 30 of a frame member 3 formed of iron to fix the joint block 12 to the frame member 3, whereby the heat radiation member is restricted from extending in the substrate surface direction due to thermal expansion, the thermal stress applied to the joint portion between the heat radiation member 1 and a ceramic substrate 2 is reduced, and exfoliation at the joint portion of the interface between a power semiconductor element and the ceramic substrate is suppressed. |
