| 摘要 |
PROBLEM TO BE SOLVED: To provide a recess formation method suitable for mass-production and capable of forming a plurality of recesses of arranged shape in the surface of a processed object with high reproducibility, and to provide a heat-treating furnace.SOLUTION: A recess formation method includes: an etching step of forming a recess by etching in a silicon carbide layer of a processed object W, i.e., a substrate having a silicon carbide layer on at least one surface; and a heat treatment step of performing heat treatment of the processed object subjected to etching. The heat treatment step includes: a step of holding the processed object subjected to etching, while opening one surface where a recess is formed, in a tray T having thermal conductivity; a step of holding a sublimation material S composed of silicon carbide so as to be located at least directly above the open surface of the recess in the direction from the tray toward the processed object; and a step of heating the processed object together with the tray and the sublimation material. |
