| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method which can inhibit poor embedment of a semiconductor chip caused by a flow of a resin which composes an encapsulation sheet.SOLUTION: A semiconductor device manufacturing method comprises: a process A of preparing a carrier with a chip; a process B of preparing a frame jig which can be arranged to surround a circumference of the carrier and has a thickness thinner than a total of a thickness of the carrier and a thickness of the chip; a process C of arranging the frame jig and the carrier with the chip which can be arranged to surround a circumference of the carrier with the frame jig; a process D of preparing an encapsulation sheet having a shape in plan view, which at least fits the carrier; a process E of arranging the encapsulation sheet on the semiconductor chip after the process C and the process D; and a process F of embedding the semiconductor chip in the encapsulation sheet to form an encapsulated body where the semiconductor chip is embedded in the encapsulation sheet. |
