发明名称 |
FLIP CHIP PACKAGE HAVING CHIP FIXING STRUCTURE |
摘要 |
A flip chip package comprises: a chip having a main bump and a dummy bump arranged in a first area and a second area, respectively; a substrate having a dam protruded from one surface, and a connection pad connected to the main bump; and an attaching means for mutually attaching the dummy bump and the dam. |
申请公布号 |
KR20150136393(A) |
申请公布日期 |
2015.12.07 |
申请号 |
KR20140063832 |
申请日期 |
2014.05.27 |
申请人 |
SK HYNIX INC. |
发明人 |
JEONG, JUNG TAE;KIM, SI EON;AHN, JONG WOO |
分类号 |
H01L23/48;H01L21/60 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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