| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic device package capable of obtaining a hardened body with a flat surface, and a method for sealing an electronic device.SOLUTION: The present invention relates to a method for manufacturing an electronic device package and the like. The method for manufacturing an electronic device package includes the steps of: forming a closed container with a stage and a film by pressing a peripheral part of a laminate structure provided with a device temporary fixing body, a thermosetting resin sheet arranged on the device temporary fixing body, a hard plate arranged on the thermosetting resin sheet, and a film including a central part in contact with the hard plate and a peripheral part arranged around the central part against a stage in contact with the device temporary fixing body; and covering an electronic device with the thermosetting resin sheet by increasing the outer pressure of the closed container to be higher than the inner pressure of the closed container. |
