OPTICAL SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND OPTICAL SEMICONDUCTOR DEVICE MANUFACTURING APPARATUS

摘要

PROBLEM TO BE SOLVED: To inhibit spread of underfill to a surface of an optical semiconductor chip and successfully fill underfill between a wiring board and an optical semiconductor chip.SOLUTION: An optical semiconductor device manufacturing method comprises: a first process S1 of preparing a work W where an optical semiconductor chip 3 is connected to a wiring board 2; a second process S2 of making a state of a tip 23a of a discharge nozzle 23 be arranged on a first edge E1 side of the optical semiconductor chip 3; a third process S3 of making a state of the tip 23a of the discharge nozzle 23 be arranged closer to the wiring board 2 side than a surface 3a of the optical semiconductor chip 3; a fourth process S4 of making a state of a discharge direction A2 incline against a connection surface 2a of the wiring board 2; and a fifth process S5 of intermittently discharge underfill 6 from the discharge nozzle 23 to fill a gap between the optical semiconductor chip 3 and the wiring board 2 with the underfill 6.