| 摘要 |
In an electroplating process for performing all nickel strike platings, the present invention relates to a technology for solving a problem of being grown in 100 direction of the nickel strike plating first, by using a nickel strike correction plating process. The present invention can solve appearance fault due to rolling fault by performing the nickel strike correction plating for a very short time after the nickel strike plating, and also can solve metal substrate surface planarization technology by the wet plating process simply without depending on rolling, in technology development of a broad (1m) steel material (STS/plated steel sheet) for a flexible thin film photovoltaic cell which is a core subject of sunlight utilization technology. In the electroplating process thereafter, it is not necessary to use polish particularly. A wet electroplating method of the present invention can obtain a beautiful white plated layer without using the polish, and has low difference according to a high current and a low current, and has good solderability. The method is good for long-term storage by suppressing surface oxidation. |
