发明名称 |
METHOD OF ABSORBING SENSIBLE AND LATENT HEAT WITH SERIES-CONNECTED HEAT SINKS |
摘要 |
A method of absorbing heat from two or more devices can employ a two-phase cooling apparatus that pumps low-pressure coolant through two or more fluidly-connected and series-connected heat sink modules. A flow of subcooled single-phase liquid coolant can be provided to an inlet of a first heat sink module in thermal communication with a first device. Within the first heat sink module, the flow of subcooled single-phase liquid coolant can absorb a first amount of heat from the first device as sensible heat. The flow of subcooled single-phase liquid coolant can be transported from an outlet of the first heat sink module to an inlet of a second heat sink module. Within the second heat sink module, the flow of subcooled single-phase liquid coolant can absorb a second amount of heat from the second device partially as sensible heat and partially as latent heat and thereby transform to two-phase bubbly flow. |
申请公布号 |
US2015351290(A1) |
申请公布日期 |
2015.12.03 |
申请号 |
US201514723388 |
申请日期 |
2015.05.27 |
申请人 |
EBULLIENT, LLC |
发明人 |
Shedd Timothy A. |
分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
1. A method of cooling two or more processors of a server by absorbing sensible heat and latent heat in coolant flowing through two or more series-connected heat sink modules, the method comprising:
providing a flow of subcooled single-phase liquid coolant to an inlet of a first heat sink module in thermal communication with a first processor of a server, wherein the subcooled single-phase liquid coolant absorbs a first amount of heat from the first processor as sensible heat; and transporting the flow of subcooled single-phase liquid coolant from an outlet of the first heat sink module to an inlet of a second heat sink module in thermal communication with a second processor of the server, wherein the flow of subcooled single-phase liquid absorbs a second amount of heat from the second processor as sensible heat resulting in the flow of subcooled single-phase liquid coolant reaching its saturation temperature and becoming a flow of saturated single-phase liquid coolant, wherein the flow of saturated single-phase liquid coolant absorbs a third amount of heat from the second processor as latent heat resulting in vaporization of a first portion of the flow of saturated single-phase liquid coolant thereby changing the flow of saturated single-phase liquid coolant to two-phase bubbly flow comprising saturated liquid coolant with vapor coolant dispersed as bubbles in the saturated liquid coolant. |
地址 |
Madison WI US |