| 发明名称 |
CIRCUIT BOARD AND METHOD OF MANUFACTURING CIRCUIT BOARD |
| 摘要 |
Disclosed herein is a circuit board in which a metal plate is provided on a surface coupled to a device, and a connection pad is exposed through an opening part of the metal plate to be electrically connected to the device. The circuit board may have the device mounted thereon and a connection terminal of the device and a connection pad of the circuit board may be connected to each other by a wire, or the like. |
| 申请公布号 |
US2015351231(A1) |
申请公布日期 |
2015.12.03 |
| 申请号 |
US201514722066 |
申请日期 |
2015.05.26 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
LEE Young Kwan;KANG Myung Sam;KOOK Seung Yeop;KWON Kwang Hee;LEE Seung Eun;SUNG Ki Jung |
| 分类号 |
H05K1/02;H05K3/30;H05K3/00;H05K3/40;H05K1/11;H05K1/09 |
主分类号 |
H05K1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A circuit board, wherein a first opening part penetrating through a metal plate is provided in the metal plate having a first insulating material provided on one surface thereof, and a first connection pad for external device connection is exposed to a direction of the other surface of the metal plate through the first opening part. |
| 地址 |
Suwon-Si KR |
