SEMICONDUCTOR CHIPS WITH SMALL SCALE STRUCTURES FOR LIQUID COOLING

摘要

A semiconductor assembly for use with forced liquid and gas cooling. A relatively rigid nano-structure (for example, array of elongated nanowires) extends from an interior surface of a cap toward a top surface of a semiconductor chip, but, because of the rigidness and structural integrity of the nano-structure built into the cap, and of the cap itself, the nano-structure is reliably spaced apart from the top surface of the chip, which helps allow for appropriate cooling fluid flows. The cap piece and nano-structures built into the cap may be made of silicon or silicon compounds.

主权项

1. A semiconductor assembly including:
a substrate member including a first chip and a top surface; and a cap member with a first recess formed therein, the cap member including a first recess surface and a first set of rigid small scale structure(s) extending from at least a portion of the first recess surface into the first recess, with the first recess surface and the first set of rigid small scale structure(s) defining the first recess; wherein: the first set of rigid small scale structure(s) include a structure having formed therein pores, gaps and or interstitial spaces equal to or less than 100 micrometers; the first set of rigid small scale structure(s) are sized, shaped and located to provide for appropriate fluid flow when gas and liquid are circulated through the first recess for gas-assisted direct liquid cooling; and the cap member is attached to the top surface of the substrate member at a location such that circulation of gas and liquid through the first recess cools the first chip by gas-assisted direct liquid cooling.