发明名称 SEMICONDUCTOR PROCESS
摘要 A semiconductor process includes the following steps. A first gate is formed on a substrate, wherein the first gate includes a stacked gate on the substrate and a cap on the stacked gate. A spacer material is formed to conformally cover the first gate and the substrate. The spacer material is etched to form a spacer on a side of the first gate and a block on the other side of the first gate corresponding to the side. A material covers the substrate, the block, the first gate and the spacer, wherein the top surface of the material is a flat surface. The block, the spacer and the material are pulled down with the same pulling selectivity so that an assisting gate is formed from the block and a selective gate is formed from the spacer.
申请公布号 US2015348789(A1) 申请公布日期 2015.12.03
申请号 US201414288399 申请日期 2014.05.28
申请人 UNITED MICROELECTRONICS CORP. 发明人 Liao Duan Quan;Cheng Wei;Chen Yikun;TEY CHING HWA;Zhu Xiao Zhong
分类号 H01L21/28 主分类号 H01L21/28
代理机构 代理人
主权项 1. A semiconductor process, comprising: forming a first gate on a substrate, wherein the first gate comprises a stacked gate on the substrate and a cap on the stacked gate; forming a spacer material to conformally cover the first gate and the substrate; etching the spacer material to form a spacer on a side of the first gate and a block on the other side of the first gate corresponding to the side; covering a material on the substrate, the block, the first gate and the spacer, wherein the top surface of the material is a flat surface; and pulling down the block, the spacer and the material with the same pulling selectivity, thereby forming an assisting gate from the block, and a selective gate from the spacer.
地址 Hsin-Chu City TW