发明名称 |
SEMICONDUCTOR PROCESS |
摘要 |
A semiconductor process includes the following steps. A first gate is formed on a substrate, wherein the first gate includes a stacked gate on the substrate and a cap on the stacked gate. A spacer material is formed to conformally cover the first gate and the substrate. The spacer material is etched to form a spacer on a side of the first gate and a block on the other side of the first gate corresponding to the side. A material covers the substrate, the block, the first gate and the spacer, wherein the top surface of the material is a flat surface. The block, the spacer and the material are pulled down with the same pulling selectivity so that an assisting gate is formed from the block and a selective gate is formed from the spacer. |
申请公布号 |
US2015348789(A1) |
申请公布日期 |
2015.12.03 |
申请号 |
US201414288399 |
申请日期 |
2014.05.28 |
申请人 |
UNITED MICROELECTRONICS CORP. |
发明人 |
Liao Duan Quan;Cheng Wei;Chen Yikun;TEY CHING HWA;Zhu Xiao Zhong |
分类号 |
H01L21/28 |
主分类号 |
H01L21/28 |
代理机构 |
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代理人 |
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主权项 |
1. A semiconductor process, comprising:
forming a first gate on a substrate, wherein the first gate comprises a stacked gate on the substrate and a cap on the stacked gate; forming a spacer material to conformally cover the first gate and the substrate; etching the spacer material to form a spacer on a side of the first gate and a block on the other side of the first gate corresponding to the side; covering a material on the substrate, the block, the first gate and the spacer, wherein the top surface of the material is a flat surface; and pulling down the block, the spacer and the material with the same pulling selectivity, thereby forming an assisting gate from the block, and a selective gate from the spacer. |
地址 |
Hsin-Chu City TW |