发明名称 |
ULTRA THIN FILM OF COPPER HAVING BUMP AND FABRICATION METHOD FOR PRINTED CIRCUIT BOARD USING THE SAME |
摘要 |
According to the present invention, a method for manufacturing carrier copper foil comprises the following steps of: providing a carrier; forming a separation induction layer on a surface of the carrier; forming a copper foil layer on the separation induction layer; and forming bumps on the copper foil. |
申请公布号 |
KR101573913(B1) |
申请公布日期 |
2015.12.03 |
申请号 |
KR20150042560 |
申请日期 |
2015.03.26 |
申请人 |
YMT CO., LTD. |
发明人 |
CHUN, SUNG WOOK;KIM, IK BEOM;CHUN, SANG WOOK;LEE, DAE HOON;KANG, YOUN BONG;KIM, JUNG IL;SIM, SOO HYEON |
分类号 |
H05K1/09;B32B15/01;H05K3/02 |
主分类号 |
H05K1/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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