发明名称 HEAT PUMP TYPE AIR COOLING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a heat pump type air cooling device which maintains air-cooling capacity high during a simultaneous operation of air-cooling and heating of a heated fluid, and which can execute pump-down.SOLUTION: A heat pump type air cooling device includes: an evaporator (41); a first condenser (61) for performing heat exchange between a refrigerant and a heated fluid; a second condenser (51) for performing heat exchange between the refrigerant and outside air; a compressor (46) for compressing the refrigerant sent from the evaporator (41); and first refrigerant flow control means (71, 73) for selectively forming a first refrigerant flow in which the refrigerant sent from the compressor (46) is supplied toward the first condenser (61) and the second condenser (51) arrayed in series on a refrigeration circuit (21), and a second refrigerant flow in which the refrigerant sent from the compressor (46) is supplied toward the first condenser (61) and the second condenser (51) arrayed in parallel on the refrigeration circuit (21).
申请公布号 JP2015215117(A) 申请公布日期 2015.12.03
申请号 JP20140097565 申请日期 2014.05.09
申请人 SHARP CORP 发明人 OTA KOJI;HONDA ATSUSHI
分类号 F25B29/00;F24F5/00;F24H1/00;F25B1/00;F25B6/02;F25B6/04 主分类号 F25B29/00
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