| 摘要 |
PROBLEM TO BE SOLVED: To provide a new heat-dissipating adhesive resin composition that achieves both heat dissipation performance and self-adhesiveness, and a heat-dissipating adhesive sheet obtained by molding the resin composition.SOLUTION: The heat-dissipating adhesive resin composition is a composition comprising a copolymer (A) comprising styrene and isobutylene, a thermally conductive filler (B) with an average particle diameter of 0.070-0.120 mm, and a liquid paraffin (C), wherein the ratio of the (B) component is 70-85 mass% and the ratio of the (C) component is 1-10 mass%. |
