| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat-resistant polyimide film having excellent high-temperature processability and suitable for manufacturing a laminate that can be used for providing a film device with excellent heat resistance and comprises a support body and a polyimide film.SOLUTION: The polyimide film is suitable for manufacturing a laminate comprising at least a support body and a polyimide film and satisfies such conditions that: (1) the surface roughness is 1.5 nm or less; (2) an atomic ratio O/C ranges from 0.3 to 0.45; and (b) an atomic ratio N/O ranges from 0.40 to 0.50. |
