SEMICONDUCTOR DEVICE AND TEST SYSTEM FOR THE SEMICONDUCTOR DEVICE

摘要

A semiconductor package including a stress mitigation unit that mitigates stress to the semiconductor chip. The semiconductor package includes a substrate, a semiconductor chip on the substrate, an encapsulation member formed on the substrate and covering the first semiconductor chip, and the stress mitigation unit mitigating stress from a circumference of the first semiconductor chip to the first semiconductor chip. The stress mitigation unit includes at least one groove formed in the encapsulation member.

主权项

1. A semiconductor device comprising:
a first substrate; a first semiconductor chip on the first substrate; an encapsulation member on the first substrate and covering the first semiconductor chip; and at least one groove formed in the encapsulation member, wherein the groove is formed in an inner portion of the encapsulation member, and lacks an entrance at a side surface or a top surface of the encapsulation member.