| 摘要 |
A cutting edge (51) is slid across the surface (SF1) of a brittle substrate (4) so as to cause plastic deformation and form a trench line (TL). The step in which said trench line (TL) is formed is performed in such a manner so as to produce a crack-free state in which, directly underneath the trench line (TL), the brittle substrate (4) is connected in a continuous fashion in a direction that intersects the trench line (TL). Next, a film (21) that at least partially covers the trench line (TL) is formed on the surface (SF1) of the brittle substrate (4), and a crack is then made to extend along the trench line (TL), forming a crack line (CL). |
