| 摘要 |
An encapsulation substrate (2) and an encapsulation method, which belong to the technical field of display and can solve the problem that an existing encapsulation substrate (2) is easily damaged during encapsulation. The encapsulation substrate (2) comprises a base (21) and a pressure bearing layer (23) arranged at one side of the base (21) for coming into contact with a pressure head (9) during encapsulation, wherein the projection of the pressure bearing layer (23) on the base (21) coincides with a region of the base (21) corresponding to an encapsulation region (Q1) during encapsulation. The present invention can be used for the encapsulation of an organic light-emitting diode display panel, especially the encapsulation of a flexible organic light-emitting diode display panel. |
