CLAMP WITH BURLS-ELECTRODE

摘要

Holding apparatus (100) for electrostatically holding component (1), (e.g., a silicon wafer), includes base body (10) composed of first and second plates (11A,12), the first plate being arranged on upper side (10A) of base body (10) and second plate (12) carrying first plate (11A), and second plate (12) being an electrically insulating material, a plurality of projecting, upper burls (13A) arranged on upper side (10A) and forming a support surface for component (1), and first electrode device (20A) having first electrodes (21A) arranged on upper side (10A) for receiving a clamping voltage, wherein first plate (11A) is produced from electrically conductive, Si-based ceramic and carries upper plate insulating layer (14A) which covers upper side (10A), having upper burls (13A), and the first electrodes (21A) include electrode layers arranged on upper burls (13A) and each carry upper electrode insulating layer (15A). A method for producing the holding apparatus is also described.

主权项

1. A holding apparatus configured to electrostatically hold a component, comprising:
a base body which comprises a first plate and a second plate, the first plate being arranged on an upper side of the base body and the second plate carrying the first plate, and the second plate comprising an electrically insulating material, a plurality of projecting, upper burls which are arranged on the upper side of the base body and form a support surface for the component, and a first electrode device having a plurality of first electrodes which are arranged on the upper side of the base body for receiving a clamping voltage, wherein the first plate comprises an electrically conductive, Si-based ceramic and carries an upper plate insulating layer which covers the upper side of the base body having the upper burls, and the first electrodes comprise electrode layers which are arranged on the upper burls and each carry an upper electrode insulating layer.