| 摘要 |
A method for electroplating a substrate is provided, including: providing a substrate having a conductive layer disposed on a top surface of the substrate, the top surface of the substrate having an edge exclusion region and a process region; directing a flow of an electroless deposition solution toward the edge exclusion region while the substrate is rotated, to plate metallic material over the conductive layer at the edge exclusion region; continuing the flow of the electroless deposition solution for a period of time to produce an increased thickness of the metallic material at the edge exclusion region, wherein the increased thickness of the metallic material reduces electrical resistance of the metallic material at the edge exclusion region; applying electrical contacts over the metallic material, and applying electrical current to the metallic material via the electrical contacts while an electroplating solution is applied over the process region of the substrate. |
| 主权项 |
1. A method for electroplating a substrate, comprising,
providing a substrate having a conductive layer disposed on a top surface of the substrate, the top surface of the substrate having an edge exclusion region defined as an annular area that extends to an edge of the substrate, the top surface of the substrate further having a process region defined as a central area of the substrate that extends to about the annular area; directing a flow of an electroless deposition solution toward the edge exclusion region while the substrate is rotated, the flow being directed away from the process region, such that the electroless deposition solution is substantially directed over the annular area of the edge exclusion region, the electroless deposition solution plates metallic material over the conductive layer at the edge exclusion region; continuing the flow of the electroless deposition solution for a period of time, the period of time being predefined to produce an increased thickness of the metallic material at the edge exclusion region, wherein the increased thickness of the metallic material reduces electrical resistance of the metallic material at the edge exclusion region; applying electrical contacts over the metallic material, the electrical contacts being distributed around the annular area of the edge exclusion region; and applying electrical current to the metallic material via the electrical contacts while an electroplating solution is applied over the process region of the substrate, the increased thickness and resulting reduced electrical resistance for the electrical current facilitates increasing a rate at which the process region is plated as a result of the applied electrical current and the applied electroplating solution. |
