SOLID STATE IMAGE PICKUP DEVICE, MANUFACTURING METHOD OF SOLID STATE IMAGE PICKUP DEVICE, AND ELECTRONIC APPARATUS

摘要

PROBLEM TO BE SOLVED: To reduce a manufacturing cost of a solid state image pickup device.SOLUTION: A solid state image pickup device has a second substrate having a plurality of signal processing circuits formed thereon to be arranged with a scribe area therebetween, and a first substrate having a pixel circuit including a pixel array part laminated on the second substrate. The pixel circuit is formed by division exposure, and at least some layers of each of the signal processing circuits are formed by one-shot exposure. The present technology can be applied to a solid state image pickup device such as a CMOS image sensor.