| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and a manufacturing method of the same, which can inhibit warpage of a laminated semiconductor device, and inhibit deformation of a plurality of wires for electrically connecting a semiconductor chip in a lower stage with a wiring board, especially a plurality of wires lying under a semiconductor chip in an upper stage, and inhibit generation of a void around the plurality of wires.SOLUTION: A semiconductor device comprises: a wiring board; first and second semiconductor chips mounted on one surface of the wiring board; a third semiconductor chip mounted on the first and second semiconductor chips so as to bridge the first and second semiconductor chips; first and second adhesion layers which are provided between the first and second semiconductor chips and the wiring board to bond the first and second semiconductor chips to the one surface of the wiring board; and a third adhesion layer which is provided between the third semiconductor chip and the first and second semiconductor chips to bond the third semiconductor chip to the first and second semiconductor chips, and formed thicker than each of the first and second adhesion layers. |
