METHOD FOR MANUFACTURING CIRCUIT BOARD WITH SOLDER SOLIDIFIED, METHOD FOR MANUFACTURING CIRCUIT BOARD WITH ELECTRONIC COMPONENT MOUNTED THEREON, AND DETERGENT COMPOSITION FOR FLUX

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a circuit board with solder solidified, by which even after the step of solidifying solder on some of electrodes on a circuit board with solder left un-solidified on other electrodes, the discoloration of the electrodes on which no solder solidification is performed can be suppressed.SOLUTION: A method for manufacturing a circuit board comprises the steps of: (1) processing, by a metal treatment agent A, metal conductive parts of a circuit board having electrodes for circuit formation in first and second regions of a support base; (2) applying flux B and solder to the electrodes of the first region of the circuit board obtained by the step (1) to solidify the solder; (3) cleaning flux residue off the circuit board obtained by the step (2) by use of a detergent C including glycol ether, alkanolamine, and an imidazole compound expressed by the following general formula (I); and (4) solidifying solder on the electrodes of the second region of the circuit board subsequently to the step (3).