| 发明名称 |
SEMICONDUCTOR DEVICE |
| 摘要 |
An electrode (3) is joined to a wiring substrate (2). A nut box (7) is inserted in the bent portion (5) of the electrode (3) so that the nut (6) is positioned in alignment with the opening (4) of the electrode (3). A case (8) covers the wiring substrate (2). The nut box (7) and the case (8) are members separate from each other. The nut box (7) is fixed in the electrode (3) so as not to come off from the bent portion 5). |
| 申请公布号 |
US2015351276(A1) |
申请公布日期 |
2015.12.03 |
| 申请号 |
US201314655011 |
申请日期 |
2013.03.21 |
| 申请人 |
YASUTOMI Goro;HAYASHIDA Yukimasa;DATE Ryutaro;MITSUBISHI ELECTRIC CORPORATION |
发明人 |
YASUTOMI Goro;HAYASHIDA Yukimasa;DATE Ryutaro |
| 分类号 |
H05K7/14;H01L23/498;H01L23/053 |
主分类号 |
H05K7/14 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device comprising:
a wiring substrate; an electrode having an opening and a bent portion and joined to the wiring substrate; a nut box having a nut and inserted in the bent portion of the electrode so that the nut is positioned in alignment with the opening of the electrode; and a case covering the wiring substrate, wherein the nut box and the case are members separate from each other, and the nut box is fixed in the electrode so as not to come off from the bent portion. |
| 地址 |
US |
