| 摘要 |
PROBLEM TO BE SOLVED: To provide a sputtering apparatus which allows easily changing a control method to improve a film thickness distribution.SOLUTION: A sputtering apparatus 100 according to the invention includes: three or more of cathode partition walls 9 arranged in a substrate transportation direction to hold a target 4 for sequentially depositing a film to a substrate transported on a transportation roller 3; and a control selection unit 25 which selects and executes a control method which provides a most uniform film thickness distribution among multiple control methods for controlling a magnet driving unit 11 according to a transportation speed and the number of the target 4 used for deposition treatment. |
