LED MODULE AND LED MODULE PACKAGING STRUCTURE

摘要

An LED module includes: a substrate including main, rear, and bottom surfaces; a first light emitting element disposed on the main surface; a conductive layer formed on the substrate and electrically coupled with the first light emitting element; a first conductive bonding layer interposed between the first light emitting element and the conductive layer; a main surface insulating film formed on the main surface and covering a portion of the conductive layer; and a first wire, wherein the main surface and the rear surface face opposite directions, the bottom surface connects long sides of the main and rear surfaces, the conductive layer includes a first wire bonding portion where the first wire is bonded, and the main surface insulating film includes a first insulating portion including a portion interposed between the first light emitting element and the first wire bonding portion when viewed in a thickness direction of the substrate.

主权项

1. An LED module comprising:
a substrate including a main surface, a rear surface and a bottom surface; a first light emitting element disposed on the main surface; a conductive layer formed on the substrate and electrically coupled with the first light emitting element; a first conductive bonding layer interposed between the first light emitting element and the conductive layer; a main surface insulating film formed on the main surface and covering a portion of the conductive layer; and a first wire, wherein the main surface and the rear surface respectively face directions opposite to each other and have an elongated rectangular shape, and the bottom surface connects a long side of the main surface with a long side of the rear surface and is a mounting surface, wherein the conductive layer includes a first wire bonding portion to which the first wire is bonded, wherein the main surface insulating film includes a first insulating portion, and the first insulating portion includes a portion interposed between the first light emitting element and the first wire bonding portion when viewed in a thickness direction of the substrate perpendicular to the main surface.